Amada Miyachi Europe offers ACF Laminating/Pre-Bonding as a proven technology that is integrated in our systems. A well-known application of ACF Laminating/pre-Bonding is connecting flex-foil to glass or connecting flex-foil to PCB. For example, Conductive Film (CF) materials are commonly used for OLED & Solar Cell applications.
The ACF Bonding process is used for fine-pitch applications (> 30 mircon), as the particle size is smaller than those of heat seal connectors (HSC's). The ACF Bonding process is a two- or three-step process:
The ACF material is supplied as a reel and consists of an adhesive filled with conductive particles and a protective layer. Prior to ACF Laminating/Pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. It is cut using the half-cut method where the actual ACF material is cut and the cover-layer is used for tape transport. The ACF is then positioned over the bond surface. The ACF Laminating/Pre-Bonding is achieved by placing the thermode (Hot Bar) on the ACF material.
The ACF Bonding process is used for fine-pitch applications (> 30 microns), as the particle size is smaller than those of heat seal connectors (HSCs). ACF Bonding is a two or three-step process.
Once ACF Laminating/Pre-Bonding is completed and the flex has been aligned to match the traces on the substrate, the thermode (Hot Bar) is actuated again and the parts are heated to the bonding temperature for the ACF Final Bond cycle.