Hot Bar Systems can be used for the hot bar reflow soldering, ACF bonding, heat sealing and heat staking processes which combine our proven expertise. Hot Bar Systems include constant heat or pulsed-heat process technologies. Thermodes are the preferred solution for the reflow soldering of thermo-sensitive components such as computer chips and connectors in which tin is melted under precisely controlled temperature and contact force. The same thermode systems are also ideal for the heat sealing of flexible connections between LCDs and PCBs. Amada Miyachi Europe designs and produces a full range of automated workstations for both processes. It also modifies and automates equipment on request, to perfectly match your specific needs.