The Hot Bar stand-alone systems are a line of semi-automatic and automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-Bonding. The systems deliver high connection quality, high throughput and have a flexibility that meets even the most demanding manufacturing requirements.
Hot Bar Systems can be used for the hot bar reflow soldering, ACF bonding, heat sealing and heat staking processes which combine our proven expertise. Hot Bar Systems include constant heat or pulsed-heat process technologies. Thermodes are the preferred solution for the reflow soldering of thermo-sensitive components such as computer chips and connectors in which tin is melted under precisely controlled temperature and contact force. The same thermode systems are also ideal for the heat sealing of flexible connections between LCDs and PCBs. Amada Miyachi Europe designs and produces a full range of automated workstations for both processes. It also modifies and automates equipment on request, to perfectly match your specific needs.
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. Amada Miyachi Europe offers feasibility testing and application consulting.