Depending on your specific application, MIYACHI EAPRO’s newhorizon Heat Seal Bonding / Heat Staking Systems are available in two versions – a version using Constant Heat technology and another version using Pulsed Heat technology. The newhorizon Heat-Seal Bonding systems are fully integrated, bonding systems which join parts utilizing our proven, constant heat or pulsed heat technologies, a pneumatic bonding head and a customized hot bar thermode. The bond head can apply up to 750 Newtons of force which makes it ideal for flex-to-pcb and flex-to-LCD applications.
- Compact and flexible systems for high quality connections
- Connecting displays to PCB, bonding glass panel displays and flex foils
- User friendly system configuration, including optional plug & play modules
- Pulsed Heat process control proven technology through Uniflow-4 Power Supply
- Ideal price-performance (throughput) ratio
- CE approved
- Pneumatic bond head, X-Y Hot Bar planarity adjustment and electronic system control included