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newhorizon Hot Bar Desktop Series

The MIYACHI EAPRO newhorizon Hot Bar Desktop Series is a range of tabletop models with a wide variety of product handling automations which offer high-quality process modules at the lowest investment. All of the newhorizon Desktop Series systems can be used for: Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking.

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Products

newhorizon ACF Laminating/Pre-Bonding System

Designed for fine-pitch, ACF bonding applications (> 30 microns), the ACF (Anisotropic Conductive Film) Laminator uses a two or three-step process to connect materials such as flex-foil to glass or flex-foil to PCB. ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning it over the surface of the parts to be bonded, and moving the thermode into position.  The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.


Specifications


 

newhorizon Heat-Seal Bonding System CH

Depending on your specific application, MIYACHI EAPRO’s newhorizon Heat Seal Bonding / Heat Staking Systems are available in two versions – a version using Constant Heat technology and another version using Pulsed Heat technology. The newhorizon Heat-Seal Bonding systems are fully integrated, bonding systems which joins parts utilizing our proven, constant heat or pulsed heat technologies, a pneumatic bonding head and a customized hot bar thermode. The bond head is capable of applying up to 750 Newtons of force, which makes it ideal for flex-to-pcb and flex-to-LCD applications.


Specifications


 

newhorizon Heat-Seal Bonding System PH

Depending on your specific application, MIYACHI EAPRO’s newhorizon Heat Seal Bonding / Heat Staking Systems are available in two versions – a version using Constant Heat technology and another version using Pulsed Heat technology. The newhorizon Heat-Seal Bonding systems are fully integrated, bonding systems which join parts utilizing our proven, constant heat or pulsed heat technologies, a pneumatic bonding head and a customized hot bar thermode.  The bond head can apply up to 750 Newtons of force which makes it ideal for flex-to-pcb and flex-to-LCD applications.


Specifications


 

newhorizon Pulsed Heat Reflow Soldering System

MIYACHI EAPRO’s newhorizon Pulsed Heat Hot Bar Reflow Soldering System is a fully integrated, Hot Bar system which utilizes a pulsed heat thermode technology for Hot Bar Reflow Soldering and Heat Staking applications that require between 8 and 80 Newtons of force.


Specifications


 

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. Amada Miyachi Europe offers feasibility testing and application consulting.

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