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Hot Bar Desktop Series

The MIYACHI EAPRO Hot Bar Desktop Series is a range of table-top models that provide a wide range of product handling automation and offer high-quality process modules at the lowest investment. All of the Desktop Series systems can be used for Hot Bar Reflow Soldering, ACF Laminating, Final Bonding, Heat-Sealing and Heat Staking.

The systems are an integral part of the Hot Bar Reflow Soldering & Bonding product line and use Pulsed Heat technology, a bonding head, a quick connect block and a thermoplane thermode. All modules are mounted on a sturdy and easily adjustable frame construction. The Desktop Series includes different product handling features which can all be ”customised“ via optional plug-and-play modules to suit our customer's specific requirements.

 

Products

ACF Laminating/Pre-Bonding desktop systems

At the heart of the Desktop ACF Laminating system is the ACF module. This module positions the ACF tape accurately above the pre-loaded parts in the tooling. Prior to laminating / pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. It is cut using the half-cut method which cuts the actual ACF material. The cover-layer is used for tape transport. The ACF is now positioned over the bond surface. By placing the Hot Bar on the ACF material the laminating / pre-Bonding is achieved. After the pre-bonding cycle the head moves back to the upper position and the carrier tape is peeled off through the automatic separator module. The use of the optional Sarcon Interposer Module between the Hot Bar and the ACF is recommended.

Heat Staking desktop systems

These Desktop Pulsed Heat series are part of a line of semi-automatic and automatic systems developed for Heat Staking and offer an ideal price-performance (throughput) ratio.

The Desktop Series Pulsed Heat Series is the first in a line of semi-automatic and automatic systems developed for Heat Staking. The “PH” stands for Pulsed Heat Hot bar. “CH” which stands for Constant Heat, is also available.

Heat-Seal/ACF Final Bonding Desktop Systems

The Desktop Series deliver the same high bonding quality as the larger and more automated systems. For production environments where labour costs are conservative, it offers an ideal price-performance (throughput) ratio. The flexibility of the system also makes it perfectly suited to R&D environments and integration into larger systems.

Reflow Soldering Desktop Systems

The Desktop Series deliver the same high bonding quality as the larger and more automated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts require alignment, this can be done in the front (loading) position where the operator has sufficient free space for loading and alignment of the parts. The position of the camera offers a view that is not blocked by the bonding head. The automatic slide makes improves control when positioning parts positioning compared to manually operated slides. It also enables the operator to spend time on other actions. such as preparing the next parts in between bonding cycles.

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. Amada Miyachi Europe offers feasibility testing and application consulting.

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