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Hot Bar Modules

Amada Miyachi Europe offers a full range of bonding heads that are available for the Hot Bar product line.

The bonding heads can be used for Hot bar reflow soldering, ACF-Laminating, Heat Seal Bonding and Heat Staking. The bonding heads offer maximum productivity and consistent process control. They have modular, compact and rigid designs and can be easily adjusted.

Products

Bonding Heads

Amada Miyachi Europe offers a full range of bonding heads which are available for the Hot Bar product line.
The bonding heads can be used for Hot Bar reflow soldering, ACF-Laminating, Heat Seal Bonding and Heat Staking. The bonding heads offer maximum productivity and consistent process control. The designs are modular, compact, rigid and easily adjustable.


 

Interposer Module

The interposer module is a reel-to-reel feeding module using a left and right sub-module which makes it independent of the Hot Bar length. The module holds a full spool of interposer on the left side and the feeder part on the right side collects the used Interposer material. An intelligent spring mechanism in the module prevents the interposer material from sticking to the Hot Bar after bonding. The tension on the interposer material is automatically controlled through a spring-operated level. The Interposer Module is available in manual and fully-automatic configurations which can be applied to all of Amada Miyachi Europe’s Hot Bar systems.


 

Thermo-plane Thermodes

The Thermode (Hot bar), which is at the heart of each bonding system, has been specially designed by Amada Miyachi Europe for a range of applications. Since each customer application demands its own specific requirements, Amada Miyachi Europe offers a complete range of pulsed-heat thermodes (Hot bars).The MIYACHI EAPRO thermode design offers ultra-fast heating and cooling cycles and hence minimises process times.  Forced air-cooling after the heating process further speeds the total bonding process. The thermode is designed to maintain co-planarity and withstand the deformation that results from the high forces that may be necessary in some bonding processes. The Thermo-plane Thermode eliminates voltage drop as current flows through the thermode from front-to-back instead of from left-to-right, preventing damage to the parts when soldering.


 

UNIFLOW4 Power Supply

UNIFLOW4 is a new power supply for Hot Bar Reflow Soldering, Heat-Sealing, ACF Laminating and Heat Staking technologies. It utilises pulsed heat technology to provide targeted heating and precision temperature control for a variety of components including flex circuits, ribbon cables, wires, SMT components, single or dual-sided edge connectors and thermo-compression bonding of gold ribbon.


 

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. Amada Miyachi Europe offers feasibility testing and application consulting.

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